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4,4′-Methylenebis(2,6-dimethylphenylcyanate) CAS 101657-77-6


  • CAS:101657-77-6
  • Cov mis molecular:C₁₉H₁₈N₂O₂
  • Qhov Hnyav Molecular:306.36
  • Daim Ntawv:Hmoov
  • Cov lus txhais:Cyanic acid methylenebis (2,6-dimethyl-4,1-phenylene) ester; tetramethyl bisphenol f cyanate ester; METHYLENEBIS (2,6-DIMETHYL-4,1-PHENYLENE) ESTEROFCYANICA.; CYANICACID,METHYLENEBIS (2,6-DIMETHYL-4,1-PHENYLENE) EST.
  • Cov Khoom Qhia Txog Khoom

    Rub tawm

    Cov Cim Npe Khoom

    Txheej Txheem Cej Luam Khoom

    Qhov tsis muaj viscosity, yooj yim ua: Pawg methyl thaiv cov zog intermolecular, ua rau muaj viscosity yaj qis. 4,4′-Methylenebis(2,6-dimethylphenylcyanate) (CAS 101657-77-6) yog qhov tsim nyog rau RTM, winding, thiab prepreg cov txheej txheem.
    Tsis muaj dielectric tsawg, ruaj khov zaus siab: Tom qab kho, Dk ≈ 2.9, Df < 0.001 (10GHz). Qhov poob qis heev ntawm cov zaus siab, ua rau nws tsim nyog rau 5G/6G millimeter nthwv dej xwm txheej.
    Kev tiv taus kub siab, kev nqus dej tsawg: Tg ≈ 260–290 ℃, kev pabcuam kub ntev 190–220 ℃; tus nqi nqus dej <0.8%, thiab tus nqi khaws cia kev ua tau zoo hauv qhov chaw kub noo yog siab.
    Tshuaj lom tsawg, tsis muaj BPA: Ib qho hloov pauv bisphenol A, tsis muaj kev pheej hmoo ntawm kev cuam tshuam endocrine, thiab muaj kev nyab xeeb dua.

    Cov Lus Qhia Tshwj Xeeb

    Khoom Cov Lus Qhia Tshwj Xeeb
    CAS 101657-77-6
    Daim Ntawv Hmoov
    Qhov Ceev 1.14
    Qhov taw tes kub hnyiab 162°C

    Daim Ntawv Thov

    1. Cov txheej txheem siab ceev tooj liab-clad laminate (core)
    4,4′-Methylenebis(2,6-dimethylphenylcyanate) siv rau hauv 5G/6G chaw nres tsheb kav hlau txais xov tooj cua, millimeter-wave radar boards, thiab high-speed server PCBs, hloov BADCy / epoxy, txo qhov poob ntawm lub teeb liab thiab txhim kho qhov nrawm ntawm kev sib kis.
    Tus Sawv Cev: Hydrocarbon resin tooj liab-clad laminate, high-frequency PTFE composite board's matrix resin.
    2. Cov khoom siv hluav taws xob zoo tshaj plaws thiab cov khoom siv hauv qab
    4,4′-Methylenebis(2,6-dimethylphenylcyanate) chip packaging substrate, IC carrier board, high-frequency connector, insulating spacer, tsim rau kev vuam kub thiab noo noo ntev.
    3. Cov ntaub ntawv sib xyaw ua ke thiab cov txheej txheem ua haujlwm siab
    4,4′-Methylenebis(2,6-dimethylphenylcyanate) ablative-resistant khoom, high-temperature insulation coating, electromagnetic shielding khoom; copolymerized nrog epoxy / BMI kom sib npaug tus nqi thiab kev ua tau zoo.

    Ntim & Xa Khoom

    • Cov Khoom Txheem: 25 kg/hnab; 25 kg/nruas
    • MOQ: yuav tsum tau lees paub los ntawm qib thiab qhov chaw mus
    • Lub Sijhawm Ua Ntej: yuav tsum tau lees paub los ntawm qhov ntau thiab tsawg ntawm kev txiav txim thiab lub sijhawm tsim khoom
    • Kev xa khoom: kev xaiv hiav txwv / cua / kev xa khoom sai muaj

    Kev Khaws Cia & Kev Ua Haujlwm

    • Khaws cia rau qhov chaw txias, qhuav, thiab muaj cua nkag tau zoo.
    • Khaws lub thawv kom kaw ruaj thiab tiv thaiv kom tsis txhob muaj dej noo.
    • Tsis txhob cia tshav ntuj ncaj qha, cua sov, thiab hluav taws qhib.
    • Ua raws li cov lus qhia ntawm SDS rau cov khoom siv uas tsis sib xws.


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    Sau koj cov lus ntawm no thiab xa tuaj rau peb