BIS (2-METHACRYLOXYETHYL) PHOSPHATE CAS 32435-46-4

CAS:32435-46-4

Molecular Formula:C12H19O8P

Molecular Luj:322.25 Nws

EINECS:251-040-2

Synonyms:BIS (2-METHACRYLOXYETHYL) Phosphate; MONOACRYLOXYETHYLPHOSPHATE; 2-Propenoicacid, 2-methyl-, phosphinicobis (oxy-2,1-ethanediyl) ester; Bis (2-methacryloyloxyethyl) hydrogenphosphate; Bismethacrylicacid (phosphinicobisoxybisethylene) ester; Bismethacrylicacidphosphinicobis (oxyethylene) ester; KayamerPM-2; Phosphoricacidbis (2-methacryloyloxyethyl) ester

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BIS (2-METHACRYLOXYETHYL) PHOSPHATE CAS 32435-46-4 yog dab tsi?

BIS (2-METHACRYLOXYETHYL) PHOSPHATE tsis tshua muaj chroma, tsis tshua muaj ntxhiab Nws muaj qhov zoo ntawm kev txhim kho cov nplaum nplaum thiab nplaum lub zog ntawm cov ntaub ntawv, zoo acid thiab alkali tsis kam, dej tsis kam, tsawg shrinkage, thiab lwm yam.

Specification

ITEM	STANDARD	TSEEM CEEB
Qhov tshwm sim	Colorless ntshiab kua	Ua raws
Xim (Hazen)	≤ 30	10
Qhov ntom(25℃)	1.230-1.265 g / ml	1.24g / ml
viscosity(25℃)	500-730 mPa · s	650 mPa
Acid nqi	235-270 mgKOH/g	246 mg KOH/g
Dej	≤ 0.2%	ND
Dawb acid	≤ 3.0%	1.38%
MEHQ	200-500 ppm	378ppm ua

Daim ntawv thov

1. UV curable resin raw khoom;
2. UV system: adhesion txhawb rau ntau yam UV curing daim ntaub ntawv xws li UV curable coatings, UV curable inks, UV curable solder resist inks, UV nqus electroplating, thiab lwm yam;
3. Adhesion promoters rau iav txheej, hlau coatings, thiab ntoo coatings;
4. Daim ntawv thov ntawm cov nplaum.