BPA (10) EODMA CAS 41637-38-1
Diethyl carbonate yog ib yam uas tsis muaj xim thiab pob tshab kua nrog me ntsis pungent tsw. Insoluble hauv dej, soluble hauv cov kuab tshuaj organic xws li cawv thiab ether.
| Yam khoom | STANDARD |
| Qhov tshwm sim | Ntshiab thiab pob tshab |
| viscosity | 350 ~ 450 hli |
| Acid nqi | ≤ 0.50 mg KOH/g |
| Xim | ≤ 100 APH |
| Tshwj xeeb lub ntiajteb txawj nqus | 1.110 ~ 1.130 Nws |
(1) UV-kho cov ntaub ntawv (UV curing
Coatings thiab inks
Raws li kev ua kom nquag plias, nws yog siv rau hauv UV-kho coatings (xws li ntoo txheej thiab hlau coatings) los txhim kho hardness thiab tshuaj tiv thaiv.
Txo cov shrinkage kev nyuaj siab hauv luam ntawv number case los tiv thaiv substrate deformation.
3D luam ntawv resin
High reactivity thiab viscosity tsawg ua rau nws haum rau lub teeb-kho 3D luam ntawv (xws li kho hniav qauv thiab precision qhov chaw).
(2) Cov ntaub ntawv kho hniav
Composite resin
Thaum ua ke nrog iav fillers (xws li SiO₂), nws yog siv nyob rau hauv cov ntaub ntawv kho hniav (fillings, veneers), featuring ob lub zog thiab zoo nkauj.
Adhesive:
Raws li ib feem ntawm kev kho hniav adhesives, nws kho sai heev thiab muaj biocompatibility zoo.
(3) Electronic ntim
Cov khoom siv insulating
Encapsulation nplaum rau PCB (luam Circuit Court board), tshav kub-resistant thiab noo noo-pov thawj.
Photoresist
Raws li ib feem ntawm photosensitive resin, nws yog siv nyob rau hauv graphical txheej txheem ntawm semiconductor manufacturing.
(4) Adhesive
Cov nplaum nplaum
Thaum sib xyaw nrog epoxy resin, nws txhim kho toughness thiab adhesion (xws li hauv tsheb thiab aerospace bonding).
200kg / nruas
BPA (10) EODMA CAS 41637-38-1
BPA (10) EODMA CAS 41637-38-1
